2UUL MICRO JIG IC Mini Tempered Insulated Glass Fixture
2UUL MICRO JIG IC Mini Tempered Insulated Glass Fixture
Spread the cost
No lump sum. No stress. Pick a repayment term that works for your budget — and keep your cash flow intact.
- R193.82/mo 3 months
- R98.01/mo 6 months
- R51.72/mo 12 months
- From R193.82/month over 3 months, or as low as R51.72/month over 12. Total repayable over 12 months: R620.64. Interest at 20.75% p.a. applies.
- Quick online application — most people get a decision within minutes. Your first payment only kicks in 30 days after you buy.
- Mobicred is a registered South African credit provider (NCR reg. NCRCP7852). Available to SA residents aged 18+ with a valid ID and bank account.
At checkout, simply select Mobicred as your payment method.
Continue to checkoutDon't have Mobicred yet? Apply free — takes about 2 minutes →
Mobicred is a revolving credit facility provided by Retail Capital (Pty) Ltd, a registered credit provider (NCR reg. NCRCP7852) in terms of the National Credit Act 34 of 2005. Credit is subject to approval and an affordability assessment. Interest rate: 20.75% p.a. compounded monthly (1.7292%/month). Available to South African residents aged 18 and older. Full terms & conditions apply.
Import Taxes & Duties Included
Delivery: 6-13 working days
Available To Order CHNThis item is shipped from China. Learn More
Processing time: 1-3 days
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Ships from International Fulfilment Center (Standard)
Description
The 2UUL MICRO JIG IC Mini Tempered Insulated Glass Fixture is a repair fixture designed for mobile phone maintenance. It provides stability during repairs, preventing clamps from moving and ensuring efficient heat dissipation.
- Product Type: Repair Fixture
- Brand: 2UUL
- Compatibility: Mobile phones
- Material: Insulated Glass
- Key Feature: Rotary fixed design
- Intended Use: Everyday use
- Design: Rotary fixed design with no rebound
- Anti-Skid Feature: Special anti-skid pad to prevent movement during use
- Heat Dissipation: Heat sink added to the bottom of the clamp for efficient hot air discharge
- Locking Mechanism: Rotary shaft locks the motherboard or IC securely without rebound
- IC Support: Supports IC type fixtures for removal of back glue
- Force Bearing: Designed to bear the force of the IC beam, preventing breakage during removal
- Size Compatibility: Suitable for mobile phone motherboards of various sizes and shapes
- Application: Fixing during cleaning of large chips such as CPU and NAND
Questions about features, compatibility, or warranty? Chat with our local support team!
